Here you control the grid size (default 0.635mm for DIP, 0.254mm for SOIC), the layer visibility (Top, Bottom, Silk Top, Silk Bottom, and solder mask), and the measurement units (metric or imperial).
Here are some key features and benefits of Sprint Layout 7.0:
Always keep a clean backup of your "User Macros" folder. This ensures that when you upgrade to a new version, your years of custom component design transition seamlessly. Conclusion sprint layout 7 0
Compared to version 6.0, the 7.0 release introduced several critical updates:
Sprint Layout 7.0 continues the legacy of its predecessors, offering a robust feature set tailored for efficiency: 1. Intuitive User Interface Here you control the grid size (default 0
| Parameter | Details | | :--- | :--- | | | .LAY7 (proprietary, not backward-compatible with v6.0) | | Max Board Size | 1600 mm x 1600 mm (~63 in x 63 in) | | Max Layers | 2 (copper layers) + silkscreen + solder mask + mechanical | | Resolution | 0.01 mil (0.000254 mm) | | Import Formats | DXF, Gerber, Drill files, Bitmap | | Export Formats | Gerber, Excellon, G-code, HPGL, Bitmap, STEP (3D) | | Price (as of 2026) | ~€59 (Standard), €99 (Pro with 3D STEP export) |
files (HPGL) for rapid in-house prototyping. Professional Gerber/Excellon files for factory production. Key New Features & Enhancements Conclusion Compared to version 6
By adopting Sprint Layout 7.0, teams can:
Select the "Layer 2 (Bottom copper)" tab. It is usually red. Select the "Track" tool. Click on Pin 1 of the IC, then click on the pad of the resistor. Sprint Layout automatically draws the copper trace. Right-click to stop routing.