Pdf | Ipc-9704

IPC/JEDEC-9704A is the industry-standard guideline for measuring mechanical strain on Printed Circuit Boards (PCBs) during manufacturing and handling

Pinpoint which manufacturing steps subject the PCB to unacceptable levels of strain.

As electronic products shrink (think smartphones and wearables), the components—particularly Ball Grid Arrays (BGAs)—are mounted on flexible boards. Excessive flexing, bending, or vibration can lead to a failure mechanism known as . What is Pad Cratering?

IPC-9704 distinguishes between two major stress events: ipc-9704 pdf

: 12 to 16-bit analog-to-digital conversion is required for precision. Common Manufacturing Steps to Test

The original guideline was introduced as IPC/JEDEC-9704 in June 2005. The standard was updated to to incorporate the engineering realities of lead-free assembly. Standard Revision Release Date Key Focus Areas Official Source IPC/JEDEC-9704 Standardizing baseline PCB strain measurement. Available via ANSI Webstore IPC/JEDEC-9704A February 2012

. It helps engineers identify and mitigate "hidden" mechanical stresses that lead to solder joint cracking, pad cratering, and component damage. Core Purpose: Why It Matters What is Pad Cratering

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Page 18. IPC/JEDEC 9704. • Recommended strain gages. • Gage placement and attachment. • Measurement equipment. • Data analysis. R. electronics.org IPC/JEDEC-9704 Standard Only | electronics.org

The IPC-9704 standard is a critical guideline for electronics manufacturers. It focuses on using strain gages to measure stress on printed circuit boards (PCBs). High stress causes solder joint cracks, pad cratering, and component failures. Implementing IPC-9704 prevents these defects during assembly, testing, and shipping. What is IPC-9704? The standard was updated to to incorporate the

: Establishes a baseline for future process improvements and equipment calibration. Key Technical Requirements

Pinpoint specific manufacturing steps (e.g., ICT, functional testing, manual handling) that exceed safe strain limits.

If a process step exceeds the limit, implement corrective engineering controls. This might include adjusting ICT pressure pins, sharpening routing bits, or altering assembly sequences. Sourcing and Using the Official Standard